CUTM3104
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CUTM3104
Credit (0-3-1)
Course Objectives
1 To develop and understand sustainable development goals (SDGs) for our society
2 To develop and familiarization with the principles, technology, materials, and tools required for Design and Developing of PCB
3 To develop an end-to-end technical understanding to design a PCB and Developing them
4 To comply with the industry specifications, guidelines, and safety standards during work
CO | Course Outcome | Mapping CO's with PO's (High-3, Medium-2, Low-1) |
CO1 | To understand the importance of Printed Circuit Board (PCB) in today’s technology. | PO1(3), PO3(2) |
CO2 | To become familiar with the various techniques of PCB design. | PO3(1) |
CO3 | To understand the needs of the society from the compactness and portability point of view. | PO4(2), PO6(2) |
CO4 | Enterprenuership oppertunities | PO5(3) |
Module I
Introduction
Printed Circuit Boards, Surface Mount and Through Hole, Prototyping Solderless, Breadboard, Perfboard, Stripboard, Installing EAGLE, First Run, Load an Example Project, Install Third-Party Software, Installing the Adafruit and Sparkfun Libraries, Installing the Sparkfun Design Rules.
Practice:
Introduction to Eagle platform.
Create and execute a sample project.
Installing various libraries and getting familiar with the Design rules of the PCB design.
Module II
Installing circuit simulation tool.
Installing Proteus / Multisim, familiarisation with the interface, Creating a project, Building the circuit, simulating the operation for correctness, transferring to Eagle platform.
Practice:
Introduction to circuit simulation platform and installation.
Building and simulating few standard sample electronic circuits.
Create and execute a project to carry forward to PCB fabrication.
Module III
Components and Libraries
U.S. versus European Circuit Symbols, Resistors, Through-Hole Resistors, SMD Resistors, Capacitors, Through-Hole Capacitors, SMD Capacitors, Transistors and Diodes, Through-Hole Transistors, SMD Transistors and Diodes, Integrated Circuits, Through-Hole ICs (DIP), SMD ICs, Connectors, Other Components.
Practice:
Create PCB design project based on through hole technology by referring to the datasheet of the individual component. (employing 2 terminal, 3 terminal and multiple terminal components)
Re-design the project based on the surface mount technology, in reference to the datasheet of the components used. (employing 2 terminal, 3 terminal and multiple terminal components)
Module IV
Editing Schematics
The Anatomy of the Schematic Editor, The Command Toolbar, Common Commands, Other Commands, Nets, Buses, Worked Example, Starting the Schematic, Adding the Components, Adding the Supplies, Adding the Nets, Assigning Net Classes, Running the ERC.
Practice:
Create a custom component in the database.
Module V
Laying Out a Printed Circuit Board
Experimenting Layers, The Command Toolbar, Common Commands, Other Commands, The Grid, Sound Meter Layout (Through-Hole), Create a Board from the Schematic, Decide on Board Size, Position and Rotate the Components, Add Mounting Holes, Get Some Design Rules, Run the Auto-router, Tweak the Result, Run the Design Rule Checker, Text on the Silk Screen, Add Text to the Bottom Sound Meter Layout (Surface-Mount), Create a New Schematic and Board, Swap Parts on the Schematic, Resize and Tidy the Board, Manual Layout.
Practice:
Create the required routing using the built-in Auto-routing function of the platform.
Create the required routing manually and analyse the differences.
Module VI
Printed Circuit Board Fabrication
Gerber Files, Loading a CAM Job, Running a CAM Job, Measure Twice, Cut Once, Submitting a Job to a PCB Service, Follow the Instructions Photoetching, Milling PCBs, Toner Transfer.
Practice:
Develop the projects on to the copper clad by transferring the layout using various techniques available.
Etching of the layout transferred on to the copper clad and milling(drilling) of required holes for the components.
Module VII
Soldering Tools
General Tools, Tools for Surface-Mount Devices, Soldering, Through-Hole PCBs, Through-Hole Soldering, Step by Step SMD Hand Soldering, Soldering Two- and Three-Legged Components, Soldering IC Packages, SMT with Hot-Air Gun, Soldering Two- and Three-Legged Components, Soldering IC Packages, Packages with Hidden Connections, Using a Reflow Oven, Get Everything Together, Applying Solder Paste, Populating the Board, Baking the Boards.
Practice:
Assemble the components using various components supplied by university and self procured on to the project.
Testing the functionality of the project is examined and tested.
Session Plan | |
Session | Topics |
Session 1 | Printed Circuit Boards, Surface Mount and Through Hole, Prototyping Solderless, Breadboard, Perf-board, Stripboard |
Session 2 | Installing EAGLE, First Run, Load an Example Project |
Install Third-Party Software, Installing the Adafruit and Sparkfun Libraries, Installing the Sparkfun Design Rules. | |
Session 3 | Installing Proteus / Multisim, familiarisation with the interface |
Session 4 | Creating a project, Building the circuit |
Session 5 | Simulating the operation for correctness, transferring to Eagle platform |
Session 6 | U.S. versus European Circuit Symbols |
Session 7 | Resistors, Through-Hole Resistors, SMD Resistors, Capacitors, Through-Hole Capacitors, SMD Capacitors |
Session 8 | Transistors and Diodes, Through-Hole Transistors, SMD Transistors and Diodes |
Session 9 | Integrated Circuits, Through-Hole ICs (DIP), SMD ICs, Connectors, Other Components |
Session 10 | The Anatomy of the Schematic Editor, The Command Toolbar |
Session 11 | Common Commands, Other Commands, Nets, Buses |
Session 12 | Worked Example, Starting the Schematic, Adding the Components, Adding the Supplies, Adding the Nets |
Session 13 | Assigning Net Classes, Running the ERC |
Session 14 | Experimenting Layers, The Command Toolbar, Common Commands, Other Commands |
Session 15 | The Grid, Sound Meter Layout (Through-Hole), Create a Board from the Schematic |
Session 16 | Decide on Board Size, Position and Rotate the Components, Add Mounting Holes |
Session 17 | Get Some Design Rules, Run the Auto-router, Tweak the Result, Run the Design Rule Checker, Text on the Silk Screen |
Session 18 | Add Text to the Bottom Sound Meter Layout (Surface-Mount), Create a New Schematic and Board |
Session 19 | Swap Parts on the Schematic, Resize and Tidy the Board, Manual Layout |
Session 20 | Gerber Files, Loading a CAM Job, Running a CAM Job |
Session 21 | Measure Twice, Cut Once, Submitting a Job to a PCB Service |
Session 22 | Follow the Instructions Photoetching, Milling PCBs, Toner Transfer |
Session 23 | General Tools, Tools for Surface-Mount Devices, Soldering, Through-Hole PCBs |
Session 24 | Through-Hole PCBs, Through-Hole Soldering, Step by Step SMD Hand Soldering |
Session 25 | Soldering Two- and Three-Legged Components, Soldering IC Packages |
Session 26 | SMT with Hot-Air Gun, Soldering Two- and Three-Legged Components |
Session 27 | Soldering IC Packages, Packages with Hidden Connections |
Session 28 | Using a Reflow Oven, Get Everything Together, Applying Solder Paste, Populating the Board, Baking the Boards |
Assistant Professor in the Department of Electronics and Communication Engineering, Centurion University of Technology and Management, Odisha. Pursuing PhD in the field of IoT and Smart Agriculture at Centurion University of Technology and Management, Odisha. Completed masters during 2012 in VLSI and Embedded Systems from S’O’A University, Bhubaneswar. Trained and experienced in Circuits Design, Analysis […]